Intel-Backed 3D Glass Semiconductor Packaging Unit To Transform Odisha Into Global Tech Hub

The ground-breaking of India’s first Advanced 3D Glass Semiconductor Packaging Unit, backed by Intel, is scheduled to take place on 19 April 2026 in Bhubaneswar. This marks a significant milestone in India’s semiconductor journey, positioning Odisha as a global hub for cutting-edge advanced packaging technologies.The establishment of this facility represents a strategic leap in India’s ambition
The ground-breaking of India’s first Advanced 3D Glass Semiconductor Packaging Unit, backed by Intel, is scheduled to take place on 19 April 2026 in Bhubaneswar. This marks a significant milestone in India’s semiconductor journey, positioning Odisha as a global hub for cutting-edge advanced packaging technologies.The establishment of this facility represents a strategic leap in India’s ambition
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