Paras Defence Arm To Establish ₹6,200 Crore Semiconductor Packaging Facility In Madhya Pradesh

Paras Defence’s semiconductor arm, Paras Semiconductors Private Limited, has signed an MoU with the Madhya Pradesh government to establish a ₹6,200 crore advanced semiconductor packaging facility on the Ujjain–Indore Corridor, marking a major expansion of India’s chip ecosystem.The project will focus on cutting-edge OSAT technologies and is expected to generate significant employment while
Paras Defence’s semiconductor arm, Paras Semiconductors Private Limited, has signed an MoU with the Madhya Pradesh government to establish a ₹6,200 crore advanced semiconductor packaging facility on the Ujjain–Indore Corridor, marking a major expansion of India’s chip ecosystem.The project will focus on cutting-edge OSAT technologies and is expected to generate significant employment while
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