Projects Under Design Linked Incentive For Semiconductors Showing Signs of Growth

India’s Design Linked Incentive (DLI) scheme under the Semicon India Programme is demonstrating robust growth, with supported projects achieving 16 tape-outs, fabrication of six ASIC chips, filing of 10 patents, engagement of over 1,000 engineers, and leveraging more than three times private investment.The Ministry of Electronics and Information Technology (MeitY) administers the DLI scheme to
India’s Design Linked Incentive (DLI) scheme under the Semicon India Programme is demonstrating robust growth, with supported projects achieving 16 tape-outs, fabrication of six ASIC chips, filing of 10 patents, engagement of over 1,000 engineers, and leveraging more than three times private investment.The Ministry of Electronics and Information Technology (MeitY) administers the DLI scheme to
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